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第二届金刚线切割与黑硅技术论坛2017

开始时间:2017-09-18 结束时间:2017-09-18
举办地区:江苏 举办场馆:无锡
主办单位:亚化咨询
承办单位:亚化咨询
上届参会人数:280 官方网站:

 第二届金刚线切割与黑硅技术论坛2017 / 2nd Diamond Wire Sawing and Black Silicon Technology Forum 2017

 

基于单位产能硅耗少、切割效率高、辅材成本低和可切割薄硅片等优势,金刚线切割单晶硅片已基本取代传统的砂浆切割工艺,大幅增强了单晶硅片的成本竞争力,2016年单晶硅太阳电池市场份额回升至25%以上。在此背景下,多晶硅行业也正在努力推进从砂浆切割工艺到金刚线切割的升级换代。

 

金刚线切割多晶硅片主要面临断线风险和制绒困难两大问题。金刚线制备与应用技术的优化可以有效降低金刚线切多晶硅时铸锭晶体硬点导致的断线风险。而制绒添加剂技术、黑硅技术或预处理技术则可以解决金刚线切割的多晶硅片反射率高,制绒困难的问题。

 

金刚线切割多晶制绒添加剂技术不改变原有设备,增加专用添加剂,降低反射率至接近常规。而黑硅技术则可以优化陷光效果,提高多晶太阳电池效率。黑硅技术分为干法黑硅与湿法黑硅两种技术路线,各具优势,都已实现批量化生产,并可进一步升级优化。

 

金刚线切割多晶硅片和黑硅技术的普及将再次拉大多晶与单晶在硅片端的成本差距,而黑硅与PERCSEMWT等技术的组合可以进一步提升多晶电池的量产效率,增强多晶硅太阳电池路线的竞争力。预计光伏市场对电池及组件成本降低和效率提升的持续要求,将为金刚线切割和黑硅技术带来良好的市场机遇。

 

第二届金刚线切割与黑硅技术论坛将于2017918日在江苏无锡召开。会议将探讨光伏行业展望与金刚线切割和黑硅技术市场前景,金刚线切割效率提升与工艺优化,金刚线切割多晶硅片的挑战与解决方案,干法黑硅与湿法黑硅工艺路线优化黑硅电池批量生产经验与技术升级,黑硅电池与其他提升效率技术的组合应用等。

 

主题

 

1. 光伏行业展望与金刚线切割和黑硅技术市场前景

2. 金刚线切割多晶硅片的挑战与解决方案

3. 金刚线切割专用设备技术现状与生产效率的提升

4. 电镀金刚线与树脂金刚线成本控制与细线化

5. 金刚线切割冷却液与硅粉回收利用

6. 砂浆切割设备改造为金刚线切割的可行性与应用案例

7. 金刚线切割多晶硅片制绒技术比较——添加剂、黑硅与预处理

8. 解决黑硅电池CTM损失——封装工艺与组件材料优化

9. 干法黑硅工艺设备优化与产能提升

10. 湿法黑硅批量生产经验与环保解决方案

11. 湿法黑硅技术升级——提升溶液寿命,拓宽工艺窗口和简化工艺设备

12. 黑硅技术成本降低与效率提升展望

13. 黑硅电池及组件发电性能与实践应用

14. 适用于黑硅电池的导电浆料与金属化方案

15. 黑硅电池与其他提升效率技术的组合应用——PERCSEMWT

 

由于日期临近,如有意向参会或者赞助,欢迎您和我们联系。负责人:孔小姐 021-68726606-102 / 13918486381(同微信号) Emailkyq@chemweekly.

 

2nd Diamond Wire Sawing and Black Silicon Technology Forum 2017 

 

Based on the advantages of low silicon consumption per unit capacity, high cutting efficiency, low auxiliary material cost and cutting thin silicon wafers, diamond wire sawing(DWS) mono-Si wafer has basically replaced the traditional slurry sawing technology, greatly enhancing the cost competitiveness of mono-Si wafer, and mono-Si solar cell market share rose to more than 25% in 2016. In such a case, multi-Si wafer industry is also making effort to promote upgrading from slurry sawing process to DWS.

 

DWS multi-Si wafer is mainly faced with problems of broken lines and texturing difficulty. Diamond wire preparation and application optimization can effectively reduce the risk of broken lines caused by ingot crystal hard spot. Texturing additive technology, black silicon technology or pretreatment technology can optimize the light trapping effect, effectively solve high reflectivity and texturing difficulty of DWS multi wafers.

 

DWS multi-Si wafer texturing additive technology does not change the original equipment, increase the special additives, reduce the reflectivity to close to the conventional level. Black silicon technology can optimize light trapping effect to improve multi-Si solar cells efficiency. Black silicon technologies include dry method and wet method, both have their advantages. The two methods have been achieved mass production, and can further upgrade optimization.

 

The popularity of DWS multi-Si wafer and black silicon will once again widen the cost gap of multi-Si and mono-Si wafer, and the combination of black silicon with PERC, SE, MWT can further improve the efficiency and enhance the competitiveness of multi-Si solar cells. It is expected that PV market’s continuous requirements for cost reduction and efficiency improvement of cells and modules will bring good market opportunities for DWS and black silicon technology.

 

2nd Diamond Wire Sawing and Black Silicon Technology Forum 2017 will be held on 18 September in Wuxi, Jiangsu, China. The upcoming conference will discuss PV industry outlook & DWS & black silicon technology market prospects; DWS efficiency improvement and process optimization; DWS multi-Si wafer challenges and solutions; dry method and wet method black silicon process optimization; black silicon cell mass production experience and technology upgrades; combined applications of black silicon cell and other efficiency improvement technologies, etc.

 

Topics:

 

1. PV industry outlook & DWS & black silicon technology market prospects

2. DWS multi-Si wafer challenges and solutions

3. DWS equipment technology and production efficiency improvement

4. Plating and resin diamond wires cost control and thinning process

5. DWS coolants and silicon powder recycling technology

6. Feasibility and application cases of slurry sawing equipment upgrading to DWS

7. DWS multi wafer texturing technology comparison——additives, black silicon and pretreatment

8. Black silicon solar cells CTM loss solutions——encapsulating technology and module material optimization

9. Dry black silicon process equipment optimization and capacity improvement

10. Wet black silicon mass production experience and environmental protection solutions

11. Wet black silicon technology upgrade——enhance solution life, broaden process window and simplify process equipment

12. Black silicon technology cost reduction and efficiency improvement trends

13. Black silicon cell and module power generation performance and practical application

14. Black silicon solar cell paste and metallization solutions

15. Combined applications of black silicon cell and other efficiency improvement technologies——PERC, SE and MWT

 

Would you please to confirm and arrange the schedule for this event?

 

Miss Emma Kong

Tel: +86-21-68726606-102

Cell: +86-13918486381

Email: kyq@chemweekly.com

 

 

 

联系方式

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  • 传 真:
  • 邮 箱:kyq@chemweekly.com
  • Q Q:987569606
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